Handbook of Wafer Bonding

Handbook of Wafer Bonding

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The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.Samsung described a TSV repair scheme which uses redundant TSVs. If one ofthe TSVs fails, it is replaced by ... Adoption in Della#39;s Precision M6500 mobile workstations is expected starting in 2012 [27]. In early 2011 Samsung researchersanbsp;...


Title:Handbook of Wafer Bonding
Author: Peter Ramm, James Jian-Qiang Lu, Maaike M. V. Taklo
Publisher:John Wiley & Sons - 2012-02-13
ISBN-13:

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